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High Precision Multi Head Chip Mounter Machine For Optical Modules Driver Modules

    Buy cheap High Precision Multi Head Chip Mounter Machine For Optical Modules Driver Modules from wholesalers
     
    Buy cheap High Precision Multi Head Chip Mounter Machine For Optical Modules Driver Modules from wholesalers
    • Buy cheap High Precision Multi Head Chip Mounter Machine For Optical Modules Driver Modules from wholesalers

    High Precision Multi Head Chip Mounter Machine For Optical Modules Driver Modules

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    Brand Name : UW
    Certification : CE ISO
    Price : Negotiation
    Payment Terms : T/T
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    High Precision Multi Head Chip Mounter Machine For Optical Modules Driver Modules

    Equipment Applications

    Optical modules, HDMI/USB connectors, sensors, optical devices, light source modules, driver modules, etc.


    Highlights

    • High-Precision Assembly: Equipped with SP-grade silent linear guides with a straightness tolerance of within 2 μm (measured by dial indicator). Adopts system laser interferometer motion compensation technology, featuring a positioning accuracy of ±0.8 μm and a repeat positioning accuracy of ±0.4 μm. Capable of achieving fast and high-precision fixed-duration control of 6 pulses within 100 ms, ensuring consistent precision across batch-produced equipment and minimizing accuracy deviations caused by moving components.
    • Reduced Misjudgment: The nozzle is configured with an independent micro-flow air circuit, enabling separate detection of each nozzle loop to reduce system misjudgment.
    • Strong Compatibility: Compatible with both optical chip and electrical chip mounting processes.
    • Professional Services: Supported by a dedicated vision technology team, which can customize efficient and accurate positioning solutions for various product types.
    • Customization Services: A eutectic module can be added to upgrade the equipment into a eutectic die bonder.
    Technical Parameters
    Parameter Name
    Parameter Value
    Production Cycle
    3s-12s
    Mounting Accuracy
    ±3 ~ ±5μm@3σ
    Angular Accuracy
    ±0.5° @3σ
    Chip Size
    0.15×0.15mm-5×5mm (Lens to be replaced per product requirements)
    Chip Thickness
    0.076-1mm(3-40mil, standard)minimum thickness down to 0.05mm(2mil,optional)
    Substrate Size
    L: 100-300mm;W: 40-90mm(Customization optional for widths below 40 mm)
    H: 0.1-0.8mm(standard)0.8-2.0mm(optional)
    Magazine Size
    (To be provided by the customer according to product specifications)
    Wafer Size
    Compatible with 6–8 inch wafers (2-inch & 4-inch waffle packs)
    Automatic θ Calibration
    Range of ±15°
    Maximum Wafer Angle Correction
    360°
    Bonding Force
    20-300g
    Standard Track Width
    40-90mm
    PR System
    256 grayscale levels / edge detection
    Resolution
    1920pixel×2560pixel
    PR Accuracy
    5M(1920×2560pixel) FOV(16mm;×1,×2,×4)
    Angular Tolerance
    ±0.1°
    Dimensions
    W: 1630mm; H: 1160mm; D: 1500mm (Subject to actual product)
    Weight
    1200KG (Subject to actual product)

    Quality High Precision Multi Head Chip Mounter Machine For Optical Modules Driver Modules for sale
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