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| Brand Name : | UW |
| Certification : | CE ISO |
| Price : | Negotiation |
| Payment Terms : | T/T |
Equipment Applications
Optical modules, HDMI/USB connectors, sensors, optical devices, light source modules, driver modules, etc.
Highlights
Parameter Name | Parameter Value |
Production Cycle | 3s-12s |
Mounting Accuracy | ±3 ~ ±5μm@3σ |
Angular Accuracy | ±0.5° @3σ |
Chip Size | 0.15×0.15mm-5×5mm (Lens to be replaced per product requirements) |
Chip Thickness | 0.076-1mm(3-40mil, standard)minimum thickness down to
0.05mm(2mil,optional) |
Substrate Size | L: 100-300mm;W: 40-90mm(Customization optional for widths below 40
mm) H: 0.1-0.8mm(standard)0.8-2.0mm(optional) |
Magazine Size | (To be provided by the customer according to product
specifications) |
Wafer Size | Compatible with 6–8 inch wafers (2-inch & 4-inch waffle packs) |
Automatic θ Calibration | Range of ±15° |
Maximum Wafer Angle Correction | 360° |
Bonding Force | 20-300g |
Standard Track Width | 40-90mm |
PR System | 256 grayscale levels / edge detection |
Resolution | 1920pixel×2560pixel |
PR Accuracy | 5M(1920×2560pixel) FOV(16mm;×1,×2,×4) |
Angular Tolerance | ±0.1° |
Dimensions | W: 1630mm; H: 1160mm; D: 1500mm (Subject to actual product) |
Weight | 1200KG (Subject to actual product) |
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